Large Capacity Headlamp Aging Oven for Automotive Lighting | High-Temperature Environmental Test Equipment for Durability, Heat Resistance & Reliability Testing

Key Features

• Large-capacity test chamber for multiple headlamp types and sizes

• Precise temperature control using PID regulation

• Programmable multi-step temperature profiles for aging and thermal cycling

• Independent safety protection system: over-temperature alarm, power failure protection, door interlock

• Industrial-grade insulation and stainless-steel interior for long-term durability

• Customizable fixtures to fit different lamp structures

• High-efficiency airflow circulation for consistent temperature distribution

• Energy-efficient design for continuous production-line operation

• Large observation window with LED lighting

• Optional remote monitoring and data export

• Low-maintenance, modular structure

• Built to meet major international environmental test standards

International Reference Standards

IEC 60068-2-2 Dry heat test for high-temperature resistance

IEC 60068-2-14 Temperature change test / thermal cycling

IEC 60810 Performance and aging requirements for automotive lamps

ISO 16750-4 Environmental conditions for road vehicle electrical equipment

GB/T 2423.2 High-temperature aging test

Applications

• Automotive headlamps, tail lamps, brake lamps, fog lamps

• LED modules / LED drivers

• Plastic housings, reflectors, optical components

• R&D aging verification

• Production-line burn-in and reliability screening

• Material heat resistance evaluation

• Long-hour illumination simulation

Test Objects

• LED headlamps
• Halogen headlamps
• Automotive fog lamps
• DRL (Daytime Running Lights)
• LED lighting modules
• Plastic lamp housings
• Optical components
• Electronic driver modules

Test Capabilities / Test Items

• Long-duration illumination aging
• High-temperature endurance test
• Thermal stability of lamp housing materials
• LED module heat resistance verification
• Lumen maintenance & light decay observation
• Preliminary thermal cycling test
• Electronic component thermal reliability
• Deformation analysis under continuous heat

Technical Specifications